###
工程科学与技术:2018,50(5):253-262
本文二维码信息
码上扫一扫!
干气密封螺旋槽的激光加工工艺研究
(昆明理工大学 化学工程学院, 云南 昆明 650500)
Research on Laser Processing Technology of Spiral Groove for Dry Gas Seal
(Faculty of Chemical Eng., Kunming Univ. of Sci. and Technol., Kunming 650500, China)
摘要
图/表
参考文献
相似文献
本文已被:浏览 1515次   下载 761
投稿时间:2017-11-20    修订日期:2018-06-20
中文摘要: 干气密封环螺旋槽的加工质量对干气密封性能有非常显著的影响。为了获得较高的螺旋槽加工质量,并能对螺旋槽加工工艺提供有效指导,利用LM-20型光纤激光标刻机对干气密封常用的碳化硅(SiC)陶瓷材料和碳化钨(WC)硬质合金材料进行了螺旋槽激光加工工艺研究。分别考察了激光功率、扫描速度、填充间距、重复频率、标刻次数等工艺参数对螺旋槽深度hg和底表面粗糙度Ra的影响;并选用激光功率、扫描速度、重复频率、标刻次数作为4个因素,分别取3个水平对WC的正交试验结果进行了分析。试验结果表明:加工工艺参数对螺旋槽深度hg和底表面粗糙度Ra均有一定的影响,合理的工艺参数有助于提升螺旋槽的加工质量;SiC和WC材质密封环合理的工艺参数范围分别为:激光功率为8~10 W和12~14 W,扫描速度为600~1 000 mm/s和500~800 mm/s,填充间距均为0.01~0.014 mm,重复频率为50~60 kHz和20~30 kHz,标刻次数为4~6次和2~4次。正交试验结果显示:重复频率对槽深hg的影响最为显著,其次为标刻次数、扫描速度和激光功率。扫描速度对底表面粗糙度Ra的影响最为显著,其余因素对底表面粗糙度Ra的影响较小。标刻次数与激光功率、激光功率与扫描速度、扫描速度与频率的交互作用均较弱,对槽底表面加工精度的影响不大。
中文关键词: 干气密封  螺旋槽  激光加工  加工工艺
Abstract:The processing quality of spiral groove on sealing ring has a significant effect on the performance of dry gas seal. In order to obtain high spiral groove processing quality and provide an effective guidance on spiral groove processing technology, Silicon carbide (SiC) ceramic materials and tungsten carbide (WC) cemented carbide materials, which are commonly used in dry gas seals, are selected to study the laser processing technology of spiral groove by LM-20 fiber laser marking machine. The influence of laser power, scanning velocity, filling spacing, repetition frequency, marking number and other parameters on spiral groove depth hg and bottom surface roughness Ra are analyzed. The results of orthogonal test for WC are investigated with the conditions of that the laser power, scanning velocity, repetition frequency, number of marking are treated as variables and three levels are taken respectively. The experimental results show that the processing parameters have some influence on the spiral groove depth hg and the bottom surface roughness Ra, the reasonable process parameters can improve the processing quality of spiral groove. The reasonable parameters of SiC and WC sealing ring obtained by this test are listed as follow: the laser power are 8~10 W and 12~14 W, the scanning speed are 600~1 000 mm/s and 500~800 mm/s, the filling distance is 0.01~0.014 mm, the repetition frequency are 50~60 kHz and 20~30 kHz, the marking number are 4~6 times and 2~4 times. The results of orthogonal test show that the repetition frequency has the most significant effect on the groove depth hg, followed by the number of marking times, scanning speed and laser power. The scanning velocity has a significant effect on the bottom surface roughness Ra, while other factors can be neglected for Ra. The interaction between marking number and laser power, laser power and scanning velocity, scanning velocity and repetition frequency are minute, and they have a little influence on the processing accuracy of the groove bottom.
文章编号:201700973     中图分类号:TB42    文献标志码:
基金项目:国家自然科学基金资助项目(51465026)
作者简介:毛文元(1984-),男,博士生.研究方向:流体密封技术.E-mail:maowenyuanyn@163.com
引用文本:
毛文元,宋鹏云,邓强国,许恒杰,孙雪剑.干气密封螺旋槽的激光加工工艺研究[J].工程科学与技术,2018,50(5):253-262.
MAO Wenyuan,SONG Pengyun,DENG Qiangguo,XU Hengjie,SUN Xuejian.Research on Laser Processing Technology of Spiral Groove for Dry Gas Seal[J].Advanced Engineering Sciences,2018,50(5):253-262.