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Modeling of ACF–COG Interconnection Resistance and Optimization of Process Parameters
MECHANICAL ENGINEERING | 更新时间：2024-11-15
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    • Modeling of ACF–COG Interconnection Resistance and Optimization of Process Parameters

    • “在液晶显示器生产领域，专家建立了芯片互连电阻仿真体系，探究了最优工艺参数，为提高封装效率提供解决方案。”
    • Advanced Engineering Sciences   Vol. 56, Issue 5, Pages: 277-286(2024)

    • DOI：10.15961/j.jsuese.202201338    

      CLC： TN405

    • Published：20 September 2024，

      Published Online：07 March 2024，

      Received：07 December 2022，

      Revised：27 March 2023，

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  • Chen Ruiqing,Liu Lei,Jia Lei,et al.Modeling of ACF–COG interconnection resistance and optimization of process parameters[J].Advanced Engineering Sciences,2024,56(5):277–286 DOI： 10.15961/j.jsuese.202201338.

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