Experiment on Interface Bonding Performance of ECC–XPS Sandwich Composite Wallboard

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Experiment on Interface Bonding Performance of ECC–XPS Sandwich Composite Wallboard

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- Experiment on Interface Bonding Performance of ECC–XPS Sandwich Composite Wallboard
- Advanced Engineering Sciences Vol. 55, Issue 1, Pages: 232-242(2023)
- 作者机构：
  
  1.中国矿业大学江苏省土木工程环境灾变与结构可靠性重点试验室，江苏徐州 221116
  2.中国矿业大学深部岩土力学与地下工程国家重点试验室，江苏徐州 221116
  3.浙江大学建筑工程学院，浙江杭州 310058
  4.山西五建集团有限公司，山西太原 030013
- 作者简介：
- 基金信息：
- DOI：10.15961/j.jsuese.202200339
  CLC： TU528.58
- Published：20 January 2023，
  
  Published Online：15 November 2022，
  
  Received：15 April 2022，
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李雨珊,尹世平,徐世烺,等.ECC–XPS夹心复合墙板界面黏结性能试验[J].工程科学与技术,2023,55(1):232–242

Li Yushan,Yin Shiping,Xu Shilang,et al.Experiment on interface bonding performance of ECC–XPS sandwich composite wallboard[J].Advanced Engineering Sciences,2023,55(1):232–242
李雨珊,尹世平,徐世烺,等.ECC–XPS夹心复合墙板界面黏结性能试验[J].工程科学与技术,2023,55(1):232–242 DOI： 10.15961/j.jsuese.202200339.

Li Yushan,Yin Shiping,Xu Shilang,et al.Experiment on interface bonding performance of ECC–XPS sandwich composite wallboard[J].Advanced Engineering Sciences,2023,55(1):232–242 DOI： 10.15961/j.jsuese.202200339.

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