The Research and Development of a New Kind of Head Structure and Motion Mechanism

Yuan Qingke; 唐鹏; 骆少明

您当前的位置：

首页 >

文章列表页 >

The Research and Development of a New Kind of Head Structure and Motion Mechanism

更新时间：2023-11-28

- The Research and Development of a New Kind of Head Structure and Motion Mechanism
- Advanced Engineering Sciences Vol. 41, Issue 5, Pages: 182-186(2009)
- 作者机构：
  
  1. 广东工业大学
  2. 广东工业大学机电工程学院,广东,广州,510006
- 作者简介：
- 基金信息：
- DOI：
  CLC：
- Published：2009，
  
  Published Online：12 November 2008，
扫描看全文
袁清珂,唐鹏,骆少明.新型焊头结构与运动机构的研究及开发[J].工程科学与技术,2009,41(5):182-186.

Yuan Qingke, 唐鹏, 骆少明. The Research and Development of a New Kind of Head Structure and Motion Mechanism. [J]. Advanced Engineering Sciences 41(5):182-186(2009)
袁清珂,唐鹏,骆少明.新型焊头结构与运动机构的研究及开发[J].工程科学与技术,2009,41(5):182-186. DOI：

Yuan Qingke, 唐鹏, 骆少明. The Research and Development of a New Kind of Head Structure and Motion Mechanism. [J]. Advanced Engineering Sciences 41(5):182-186(2009) DOI：

摘要

中文摘要: 为实现LED芯片键合机对芯片的高速高精确地拾取、传送和粘贴等功能，本文综合运用曲柄摇杆机构和偏心轮机构开发了一种新型焊头结构与运动机构。首先，分析了焊头总成的工作过程和要求，研究了焊头机构的工作原理，设计了曲柄摇杆结构的运动参数，开发了端面偏心轮机构，讨论了焊头机构的运动时间序列。接着，应用pro/Engineer进行了零件和机构总成的结构设计，运用Mechanism/Pro建立了机构运动模型、驱动模型，实现了机构的运动仿真，分析了仿真结果，优化了焊头结构和机构参数。最后，通过实物样机的实际测试，验证了设计开发和仿真模型的正确性，所开发的焊头机构已成功应用于设备生产，提高了整机性能。

Abstract

Abstract:In this paper

a new kind of head structure and motion mechanism were developed by integrating synthetically a crank-rocker mechanism and a head face eccenter mechanism

that realize the operating functions of LED chip die bonders to drive chip of

such as picking up

carrying and bonding. Firstly

the working process and requirements of the head assembly were analyzed

the working theory of the head mecahniam was studied

the motion parameters of the crank-rocker mechanism were designed

a head face eccenter mechanism was developed

the motion time sequence of the excutive mechanisms was discussed. Secondly

the parts and assembly of the head structure and motion mechanism were designed by using pro/Engineer

the mechanim motion models and driving models were built

the motion simulation of the head mechanism was realized by using Mechanism/pro

the simulation results were analized

the head structure and mechanism parameters were optimized. Finally

the feasibility and rationality of the designed head mechanism and its simulation models were verified by testing the physical prototype

the developed head mechanism has been used in the whole equipment successfully

the performances of whole equipment have risen significantly.

关键词

半导体设备制造产品开发机构运动学焊头机构

Keywords

semiconductor device manufactureproduct developmentmechanismkinematicshead mechanism

references

Romero G,Kinemat LED analysis of mechanism by using bond-graph language,2006.

Pearn W L;Chung S H;Lai C M,Scheduling integrated circuit assembly operations on die bonder,IEEE Transactions on Electronics Packaging Manufacturing

郭强生.线性电机在高速粘片机芯片拾放机构中的应用[J].电子工业专用设备,2006(10)

Matthews K;Cady R;Kelley M,The design for an innovative semi-automatic die bonder,Piscataway,USA:IEEE,2004.

Behler S,Die bonding with polyimide tapes,Advanced Packaging,2003(1).

杨廷力,机械机构基本原理:结构学、运动学、动力学,北京:机械工业出版社,1996.

Pu P,Simulating both dynamLED and kinematLED behaviors of mechanLEDal mechanisms,ArtifLEDial Intelligence in Engineering

林光春;高山;徐礼钜.杆长和惯性参数可变的平面可调五杆机构的动力学解析模型[J].四川大学学报(工程科学版),2005(5)

马立峰,黄庆学,李颖.新型滚切剪空间剪切机构优化数学模型的建立及应用[J].四川大学学报(工程科学版),2008(2)

侣海燕;王海明.应用四连杆机构的粘片机键合头设计[J].电子工业专用设备,2007(12)

Medding J,Thin die bonding techniques,San Jose,USA:IEEE,2004.

郭强生.LED粘片机芯片拾取机构运动控制技术研究[J].电子工业专用设备,2005(6)

更多指标>

Views

204

下载量

CNKI被引量

Alert me when the article has been cited

提交

Tools

Publicity Resources

Error Modeling and Parameter Identification for Robots Based on Point-sphere Constraints

Dynamics and Power Analysis of 2–UPR&2–RPU Redundant Parallel Mechanism

Kinematics Analysis and Simulation of a Quadruped Magnetic Adsorption Wall-climbing Robot

Related Author

No data

Related Institution

. of Parallel Robotics and Mechatronic Systems in Hebei Province, Yanshan Univ., Qinhuangdao

Inst. of General Assembly and Environmental Eng., China Academy of Space Technol.

School of Mechanical Eng., Sichuan Univ.

Nanchong Key Lab. of Robotics Eng. and Intelligent Manufacturing, Southwest Petroleum Univ.

四川大学制造科学与工程学院

⁰